Summary

Supporting Assets & Related Resources

Overview

  • Nano_KiCad

    • Description: A remake of the Arduino Nano R3.3 in KiCad with a focus on minimum requirements for functionality to cater to end-use.
    • Features:
      • Clone of Original Arduino Nano based on ATMega328P
      • Removed:
        • Reset button
        • D13 LED
        • ISP header
      • Simplified routing
      • Swapped USB connector from Mini-B to Micro-B
    • Specifications:
      • 5V logic (USB-powered only)
      • No onboard voltage regulator
      • USB-to-Serial via CH340 or FT232 (based on variant)
      • Breadboard-compatible 30-pin layout
    • MCU(s):
      • ATMega328P
    • Key Components:
      • ATMega328P microcontroller
      • CH340C USB-Serial (or FT232RL variant)
      • 16 MHz crystal oscillator
    • Template Stackup:
      • 2-layer, standard Arduino Nano footprint
    • Cost Estimate:
      • TDB
    • Part Count:
      • TBD
    • Hardware Complexity:
      • Low
    • Firmware Complexity:
      • Low (Arduino IDE compatible, standard Nano bootloader)
    • Design Status:
      • Finalized
    • Test Status:
      • Untested
    • Notes:
      • None
    • Section: Nano_Minima

  • can-nano-shield

    • Description: A compact CAN transceiver/controller shield for Arduino Nano form factor, enabling reliable CAN bus communication using A4/A5 for CAN_H/L.
    • Features:
      • Drop-in Nano shield format with pass-through headers
      • Uses SMT-XH???? connector off the front edge or selectable to A4/A5 pins for CAN_H and CAN_L?????
      • Onboard MCP2515 CAN controller (SPI)
      • TJA1051/3 high-speed CAN transceiver
      • Optional 120Ω termination via jumper (SPLIT TERMINATION CONCEPT!!!!!)
      • Optional common-mode choke for EMC
      • TVS diode protection on CAN lines
    • Specifications:
      • 3.3V or 5V logic compatible (level shifted) VERIFY???? for ATM???
      • CAN 2.0B compliant, up to 1 Mbps
      • Standard 3-pin CAN output: CAN_H, GND, CAN_L
    • MCU(s):
      • Compatible with any Arduino Nano-format MCU (e.g., ATmega328P, STM32F103, RP2040)
    • Key Components:
      • MCP2515 CAN controller
      • TJA1051 or TJA1053 CAN transceiver
      • PESD2CAN TVS diode
      • Optional: Epcos B82799C0104 common-mode choke
    • Template Stackup:
      • 2-layer PCB, 1.6 mm FR4, standard 1oz copper CHECKKKKKKKQ!!!!!
    • Cost Estimate:
      • TBD
    • Part Count:
      • TBD
    • Hardware Complexity:
      • Low (simple mixed-signal I/O, minimal passive filtering)
    • Firmware Complexity:
      • Low (standard MCP2515 CAN libraries)
    • Design Status:
      • Prototype revision complete
    • Test Status:
      • Pending full functional and bus integrity testing
    • Notes:
      • I²C is unavailable on A4/A5; consider alternate breakout if needed (ADD THIS?!?!??!)
      • Section: can-nano-shield

  • Slice_TEMP

    • Description: Template slice for creating new SLICE modules, with variants supporting different mechanical and electrical configurations. Intended to standardize layout and encourage reuse.
    • Features:
      • Classic 2-layer 70mm x 100mm slice (2layer)
    • Specifications:
      • 2layer
        • WRITE
      • 4layer
      • 4layer-XL
    • MCU(s):
      • Arduino Nano Original (ATMega328P)
      • Arduino Nano Every (ATMega4809)
      • STM32 Nucleo-32 series (e.g. L432KC, F303K8)
      • Other Nano-format boards also supported:
        • Any MCU board using the standard Arduino Nano pinout and 0.1” dual-row 15x2 header format
        • Nano ESP32 and ESP32-S2 variants with Nano footprint (e.g. Nano ESP32 by Arduino, or 3rd party clones)
        • RP2040 Nano-form boards (e.g. Nano RP2040 Connect, Seeed Studio RP2040 Nano)
        • CH32V203 or CH32V003 Nano-format RISC-V dev boards
    • Key Components:
      • Nano-format header footprint
      • 12V → 5V buck converter
      • RGB LED
    • Template Stackup:
      • TBD
      • for full details see?????
    • Cost Estimate:
      • TBD
    • Part Count:
      • TBD
    • Hardware Complexity:
      • Low
    • Firmware Complexity:
      • None (template board; firmware depends on final application)
    • Design Status:
      • Stable template, ready for reuse
    • Test Status:
      • 2 layer:
        • Various previous revisions verified on multiple derived slices
      • ?!?!?!?!?!?DO
    • Notes:
      • None
    • Section: Slice_TEMP

  • Slice_PRTO

    • Description: Various slice-format boards to aid prototyping to develop even more SLICEs!
    • Features:
      • Through-hole (THT) component prototyping board
      • Surface mount (SMT) component prototyping board
      • Screw terminal connector breakout board
    • Specifications:
    • MCU(s):
    • Key Components:
    • Template Stackup:
    • Cost Estimate:
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    • Notes:
    • Section: Slice_PRTO

  • Slice_AQDO

    • Description:
    • Features:
    • Specifications:
    • MCU(s):
    • Key Components:
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    • Section: Slice_AQDO

  • Slice_AQEC

    • Description:
    • Features:
    • Specifications:
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    • Section: Slice_AQEC

  • Slice_AQOR

    • Description:
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    • Section: Slice_AQOR

  • Slice_AQPH

    • Description:
    • Features:
    • Specifications:
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    • Section: Slice_AQPH

  • Slice_BUCK

    • Description:
    • Features:
    • Specifications:
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    • Section: Slice_BUCK

  • Slice_DCMT

    • Description:
    • Features:
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    • Section: Slice_DCMT

  • Slice_HEAT

    • Description:
    • Features:
    • Specifications:
    • MCU(s):
    • Key Components:
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    • Section: Slice_HEAT

  • Slice_IAQM

    • Description:
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    • Section: Slice_IAQM

  • Slice_LEPD

    • Description:
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    • Section: Slice_LEPD

  • Slice_LOAD

    • Description:
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    • Specifications:
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    • Section: Slice_LOAD

  • Slice_LVAI

    • Description:
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    • Section: Slice_LVAI

  • Slice_RLAY

    • Description:
    • Features:
    • Specifications:
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    • Section: Slice_RLAY

  • Slice_RLHT

    • Description:
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    • Section: Slice_RLHT

  • Slice_RTDM

    • Description:
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    • Section: Slice_RTDM

  • Slice_SERV

    • Description:
    • Features:
    • Specifications:
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    • Section: Slice_SERV

  • Slice_STEP

    • Description:
    • Features:
    • Specifications:
    • MCU(s):
    • Key Components:
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    • Section: Slice_STEP

  • Slice_THRM

    • Description:
    • Features:
    • Specifications:
    • MCU(s):
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    • Section: Slice_THRM

  • Slice_USBP

    • Description:
    • Features:
    • Specifications:
    • MCU(s):
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    • Notes:
    • Section: Slice_USBP

  • Slice_VCAC

    • Description:
    • Features:
    • Specifications:
    • MCU(s):
    • Key Components:
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    • Section: Slice_VCAC

  • Slice_VCDC

    • Description:
    • Features:
    • Specifications:
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    • Section: Slice_VCDC

  • Slice_AOEM

    • Description:
    • Features:
    • Specifications:
    • MCU(s):
    • Key Components:
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    • Section: Slice_AOEM

  • Slice_GDHB

    • Description:
    • Features:
    • Specifications:
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    • Section: Slice_GDHB

  • Slice_FPSG

    • Description:
    • Features:
    • Specifications:
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    • Section: Slice_FPSG

  • Slice_SOLR

    • Description:
    • Features:
    • Specifications:
    • MCU(s):
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    • Section: Slice_SOLR

  • Slice_THMX

    • Description:
    • Features:
    • Specifications:
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    • Notes:
    • Section: Slice_THMX

Nano_Minima

Placeholder for Nano_Minima description, design notes, and usage examples.

can-nano-shield

Placeholder for CAN Nano Shield overview and integration info.

Slice_TEMP

Placeholder for Slice_TEMP variants, purpose, and configuration details.

Slice_PRTO

Placeholder for Slice_PRTO use cases and physical layout options.

Slice_AQDO

Placeholder for Slice_AQDO probe type and signal conditioning notes.

Slice_AQEC

Placeholder for Slice_AQEC notes on ORP sensing and analog frontend.

Slice_AQOR

Placeholder for Slice_AQOR design for conductivity-based sensors.

Slice_AQPH

Placeholder for Slice_AQPH compatibility and signal chain tuning.

Slice_BUCK

Placeholder for Slice_BUCK topology, efficiency considerations, and tuning.

Slice_DCMT

Placeholder for Slice_DCMT use in motor control and layout limitations.

Slice_HEAT

Placeholder for Slice_HEAT dual channel heater driver design.

Slice_IAQM

Placeholder for Slice_IAQM air quality and environmental sensor logic.

Slice_LEPD

Placeholder for Slice_LEPD optical detection and reactor integration.

Slice_LOAD

Placeholder for Slice_LOAD cell amplifier configuration and wiring.

Slice_LVAI

Placeholder for Slice_LVAI low-voltage analog input frontend tuning.

Slice_RLAY

Placeholder for Slice_RLAY relay switching control and safety features.

Slice_RLHT

Placeholder for Slice_RLHT high-temp sensor amplifier and upgrades.

Slice_RTDM

Placeholder for Slice_RTDM four-channel RTD conditioning block.

Slice_SERV

Placeholder for Slice_SERV servo control interface and power logic.

Slice_STEP

Placeholder for Slice_STEP stepper driver integration and revision needs.

Slice_THRM

Placeholder for Slice_THRM variants and thermocouple IC performance.

Slice_USBP

Placeholder for Slice_USBP power pass-through and USB data hub use.

Slice_VCAC

Placeholder for Slice_VCAC voltage/current AC monitoring frontend.

Slice_VCDC

Placeholder for Slice_VCDC voltage/current DC monitoring frontend.

Slice_AOEM

Placeholder for Slice_AOEM OEM sensor integration and isolation.

Slice_GDHB

Placeholder for Slice_GDHB high current H-bridge control logic.

Slice_FPSG

Placeholder for Slice_FPSG fast strain gauge interface system.

Slice_SOLR

Placeholder for Slice_SOLR solar charger and power management features.

Slice_THMX

Placeholder for Slice_THMX multi-channel temp sensor via LTC2983.